AIAR-SOM-I.MX93
AIAR-SOM-I.MX93
Embedded Files
The SoM supports a variety of integrated interfaces like camera inputs, 2x CAN bus, 2x GbE, audio in/out, ADC,2x USB, certified dual-band Wi-Fi 802.11 ax/ac/a/b/g/n with optional 802.15.4 and BT/BLE 5.2, LVDS and MIPI-DSI display outputs, all supported in industrial temperature grade.
AIAR-SoM-i.MX8M-93 supports advanced multimedia features along with extensive connectivity options such MIPI-DSI 1366x768p60 or 1280x800p60 parallel RGB
The AIAR-SoM-i.MX93 is a member of the AIAR-SoM Pin2Pin product family, scalability options and reduced development time, costs, and risks. Starting from, i.MX 8M Nano, i.MX 93, i.MX 8M Mini, up to i.MX 8M-Plus modules.
The Evaluation carrier board complements AIAR-SOM-i.MX8M-PLUS. For evaluation kit contact, AIAR TECHNOLOGY.LTD
Main Features
NXP i.MX 93
1.7GHz Dual-core ARM Cortex-A55
Real-time 250MHz Cortex-M33 co-processor
Neon Media Processor Engine (MPE)
AI/ML NPU 0.5 TOPS
2D pixel acceleration engine (PxP)
Up to 2GB LPDDR4 memory, up to 128GB eMMC storage
Networking
2x10/100/1000MBps Ethernet
Certified Dual-Band Wi-Fi 802.11ax/ac/a/b
G/N with Optional 802.15.4
Bluetooth/BLE 5.2
2x CAN Bus
High-speed Interfaces
2 x USB 3.0 OTG
Audio
Digital Audio (SAI, S/PDIF, RX & TX, PDM 4CH)
Headphone-out, Line-In
Digital Microphone (Stereo)
Camera
1 x MIPI CSI1 Serial Input
Other interfaces
SD/MMC, UART, I2C, SPI, QSPI, PWM, GPIO, JTAG
OS support
Linux & FreeRTOS
Dimensions (W x L x H)
67.8 mm x 33 mm x 3.4 mm
Durability
Up to -40 to 85°C industrial temperature support
Power Consumption
Optimized Low Power Consumption in Both Operational and Suspend Modes
Single 3.3V
Next Generation Module
Next Generation Module
Introducing the Next Generation Module, a powerhouse of innovation and performance that's set to revolutionize the way you approach embedded systems. Built upon NXP's cutting-edge i.MX 93 platform, this module boasts a lightning-fast dual-core Cortex-A55 processor running at up to 1.7GHz, coupled with a 250MHz Cortex-M33 real-time co-processor. What sets it apart? Integrated machine learning capabilities, allowing you to harness the power of AI and ML directly within your applications. But that's not all – with its energy-flex architecture, the Next Generation Module ensures power-efficient processing without compromising on performance. Whether you're developing smart devices, IoT solutions, or cutting-edge robotics, this module is your ticket to unlocking the full potential of embedded systems. Upgrade to the Next Generation Module and embrace the future of technology today.
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